XDV-µ Series

The models of the XDV® series are the most powerful X-ray fluorescence instruments in the Fischer portfolio. They are equipped with a highly sensitive silicon drift detector (SDD) and can further be fitted with different apertures and filters. Additionally, XDV-µ instruments come with a micro-focus tube. This makes them ideal for very demanding measurement tasks. Using XDV devices you can, for instance, analyze the thickness and elemental composition of coatings just 5 nm thick and test structures of just 10 µm.

XDV Family

Features

  • Precise measurement of the thinnest coatings with repeatable accuracy, thanks to high-performance X-ray tubes and sensitive silicon drift detectors (SDD)
  • Extremely robust construction for long-lasting serial testing, with outstanding long-term stability
  • The XDV-µ LD option with a long measuring distance (min. 12 mm)
  • An additional helium purge with the XDV-µ LEAD FRAME option provides for a very wide range of elements – from sodium (11) to uranium (92)
  • Advanced polycapillary X-ray optics to focus the X-rays on an extremely small measurement surface
  • Automated serial testing with programmable XY-table and Z-axis (optional)
  • Fast and simple positioning of the probes with the help of video imaging and laser pointer

Applications:

Coating Thickness Measurement

  • Anti-wear coatings such as NiP layers on the tiniest of watch components
  • Very thin precious-metal coatings on visible components in mechanical watch movements
  • Measuring on assembled circuit boards
  • Testing base metallization layers (Under Bump Metallization, UBM) in the nanometer range
  • Measurement of C4 and smaller solder bumps

Material Analysis

  • Detection of undesirable substances (for example heavy metals) in electronics, packaging and consumer goods according to RoHS, WEEE, CPSIA and other guidelines
  • Analysis of very light elements like sodium
  • Composition of functional coatings, such as the determination of phosphorous content in NiP
  • Analysis of gold and other precious metals, as well as alloys thereof
  • Analysis of lead-free solder caps on copper pillars
  • Testing the elemental composition of C4 and smaller solder bumps, base metallization layers (UBM) and small contact surfaces in the semiconductor industry

Your contact to FISCHER

Fischer Technology Inc.
Windsor/United States

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Phone: (860) 683-0781
E-Mail: info@fischer-technology.com
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